Title:
樹脂組成物、プリプレグ、樹脂付きフィルム、樹脂付き金属箔、金属張積層板、及び配線板
Document Type and Number:
Japanese Patent JP7190649
Kind Code:
B2
Abstract:
To provide a resin composition capable of giving a cured product having low dielectric characteristics and high heat resistance, and to provide a prepreg, a film with a resin, a metal foil with a resin, a metal-clad laminate, and a wiring board.SOLUTION: The resin composition contains: a polymer having a structural unit represented by formula (1) in the molecule; and a monofunctional maleimide compound having one maleimide group in the molecule. In the formula (1), Z represents an arylene group; R-Reach independently represent a hydrogen atom or an alkyl group; and R-Reach independently represent a hydrogen atom or a C1-6 alkyl group.SELECTED DRAWING: None
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Inventors:
Seiji Koda
Hiroaki Fujiwara
Takayoshi Ozeki
Yuki Kitai
Yasunori Hoshino
Mikio Sato
Hiroaki Fujiwara
Takayoshi Ozeki
Yuki Kitai
Yasunori Hoshino
Mikio Sato
Application Number:
JP2019045681A
Publication Date:
December 16, 2022
Filing Date:
March 13, 2019
Export Citation:
Assignee:
Panasonic IP Management Co., Ltd.
International Classes:
C08L25/00; C08F257/00; C08F290/12; C08J5/24; C08K5/3415
Domestic Patent References:
| JP2016210915A | ||||
| JP2016190899A | ||||
| JP2018039995A |
Foreign References:
| WO2013069077A1 | ||||
| WO2016104748A1 | ||||
| WO2013047305A1 | ||||
| WO2020175537A1 | ||||
| WO2020175538A1 |
Attorney, Agent or Firm:
Masataka Kotani
Masashi Jishita
Masashi Jishita