Title:
RESIN COMPOSITION FOR PRINTED WIRING BOARD, PREPREG, RESIN SUBSTRATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2018107157
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a resin composition for a printed wiring board, which is superior in fluidity and circuit moldability, and low in curing shrinkage, and which enables the materialization of a printed wiring board with fine circuit dimensions, having superior electrical insulation reliability even under a high-temperature and high-humidity condition; a prepreg; a resin substrate; and a printed wiring board and a semiconductor device which are superior in electrical insulation reliability under a high-temperature, high-humidity condition.SOLUTION: A resin composition for a printed wiring board according to the present invention comprises: a thermosetting resin (A); an inorganic filler (B); and a (meth)acrylic acid ester polymer (C) represented by the formula (1) below. In the resin composition, the (meth)acrylic acid ester polymer (C) has a weight-average molecular weight of 10000 or more and 200000. (In the formula (1), Rand Rindependently represent a hydrocarbon group with C1-8; p, q and r each represent a mole percentage of the repeating units; and p+q+r≤100 mol%.)SELECTED DRAWING: None
Inventors:
DAITO NORIYUKI
TACHIBANA KENYA
TACHIBANA KENYA
Application Number:
JP2016248740A
Publication Date:
July 05, 2018
Filing Date:
December 22, 2016
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
H05K1/03; B32B15/04; B32B15/08; B32B27/30; B32B27/38; C08J5/24; C08K3/22; C08K3/36; C08K3/40; C08K9/06; C08L33/08; C08L33/14; C08L63/00; C08L101/00; H05K3/46
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