Title:
プリント配線板用樹脂組成物、プリプレグ、レジンシート、積層板、金属箔張積層板、及びプリント配線板
Document Type and Number:
Japanese Patent JP6850548
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for a printed wiring board, which includes an organic filler and has superior moldability.SOLUTION: A resin composition for a printed wiring board comprises: a filler (A) including a polymer produced as a result of polymerization of one or more kinds selected from a group consisting of (meth)acrylic acid, (meth)acrylic acid ester, (meth)acrylonitrile, olefin and an aromatic vinyl compound and/or a silicone polymer; and a thermosetting component (B). In the filler (A), the content of filler of 3.0 μm or larger in particle diameter is 0.09 vol.% or less to a total volume of the resin composition.SELECTED DRAWING: None
Inventors:
Tomizawa Katsuya
Tomoki Hamaki
Yoichi Takano
Yamaguchi Shohei
Hiroshi Takahashi
Tomoki Hamaki
Yoichi Takano
Yamaguchi Shohei
Hiroshi Takahashi
Application Number:
JP2016086284A
Publication Date:
March 31, 2021
Filing Date:
April 22, 2016
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
H05K1/03; B32B27/20; C08J5/24; C08K3/00; C08L101/00
Domestic Patent References:
| JP201499516A | ||||
| JP2014107295A |
Foreign References:
| WO2015105109A1 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito