Title:
チップ抵抗器または圧電発音体の保護膜用樹脂組成物
Document Type and Number:
Japanese Patent JP5357697
Kind Code:
B2
Abstract:
To provide a resin composition forming a protective film for a chip resistor having excellent crack resistance or a protective film for a piezo-electric sounding body having excellent falling durability.
The resin composition includes: (A) an epoxy resin; (B) a curing agent; and (C) a liquid elastomer. In the resin composition for the protective film of the chip resistor or piezo-electric sounding body, the component (C) is 35-45 pts.mass based on 100 pts.mass of the sum of the components (A) and (C).
COPYRIGHT: (C)2011,JPO&INPIT
Inventors:
Tomoyuki Numata
Masayuki Sudo
Masayuki Sudo
Application Number:
JP2009245295A
Publication Date:
December 04, 2013
Filing Date:
October 26, 2009
Export Citation:
Assignee:
Namics Co., Ltd.
International Classes:
C08L63/00; C08K3/00; C08L13/00; C08L15/00; H01L41/09; H01L41/193
Domestic Patent References:
| JP2009091424A | ||||
| JP2006257286A | ||||
| JP2001068361A | ||||
| JP2004352806A | ||||
| JP4136083A | ||||
| JP10335389A | ||||
| JP5320317A | ||||
| JP2009144052A |
Attorney, Agent or Firm:
Yusuke Watanabe
Previous Patent: JPS5357696
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