Title:
樹脂組成物、樹脂付銅箔、誘電体層、銅張積層板、キャパシタ素子及びキャパシタ内蔵プリント配線板
Document Type and Number:
Japanese Patent JP7123786
Kind Code:
B2
Abstract:
To provide a resin composition capable of drastically improving electrostatic capacitance, while securing excellent circuit adhesiveness and excellent stickiness between resin layers, when used as a dielectric layer of a capacitor.SOLUTION: A resin composition contains a resin component containing an epoxy resin, a diamine compound, and a polyamide-imide resin, and a dielectric filler that is a composite oxide containing 70 pts.mass or larger and 85 pts.mass or smaller of at least two kinds selected from the group consisting of Ba, Ti, Sr, Pd, Zr, La, Ta and Bi relative to 100 pts.mass of a solid part of the resin composition, in which a content of the epoxy resin is 35 pts.mass or lager and 70 pts.mass or smaller relative to 100 pts.mass of the resin component, and a content of the polyamide-imide resin is 5 pts.mass or large and 30 pts.mass or smaller relative to 100 pts.mass of the resin component.SELECTED DRAWING: None
Inventors:
Toshihiro Hosoi
Kenshiro Fukuda
Yoshihiro Yoneda
Tomohiro Ishino
Tetsuro Sato
Kenshiro Fukuda
Yoshihiro Yoneda
Tomohiro Ishino
Tetsuro Sato
Application Number:
JP2018246213A
Publication Date:
August 23, 2022
Filing Date:
December 27, 2018
Export Citation:
Assignee:
Mitsui Mining & Smelting Co., Ltd.
International Classes:
C08L63/00; C08K3/22; C08L77/06; C08L79/08; H05K1/16
Domestic Patent References:
| JP2013510429A | ||||
| JP2003119379A | ||||
| JP2005262506A | ||||
| JP2006123232A | ||||
| JP2012162084A | ||||
| JP2017179196A |
Foreign References:
| WO2019150994A1 |
Attorney, Agent or Firm:
Masaharu Takamura
Hiroki Kashima
Yu Hasegawa
Hiroki Kashima
Yu Hasegawa