樹脂組成物及び樹脂フィルム - Shin-Etsu Chemical Co., Ltd.

Title:

樹脂組成物及び樹脂フィルム

Document Type and Number:

Japanese Patent JP7222955

Kind Code:

B2

Abstract:

To provide a resin composition with high strength, reduced warpage, and excellent adhesion, a high strength resin film obtained by making the composition into a film, a semiconductor laminate containing a cured material of the resin film and a method for manufacturing the same, as well as a semiconductor device obtained by separating the semiconductor laminate into individual pieces and a method for manufacturing the same.SOLUTION: A resin composition includes (A) a silicone modified epoxy resin, (B) a divinyl group and/or tetravinyl group-containing epoxy compound, (C) a bisphenol epoxy compound, (D) a phenolic curing agent, and (E) a curing accelerator, the silicone modified epoxy resin being represented by the following formula (4) and having a weight average molecular weight of 3,000-500,000.SELECTED DRAWING: None

Inventors:

Yoichiro Ichioka
Directly to Kushihara
Kazuki Kondo
Kazumasa Sumida

Application Number:

JP2020140546A

Publication Date:

February 15, 2023

Filing Date:

August 24, 2020

Export Citation:

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