Title:
樹脂組成物、樹脂シート、多層プリント配線板及び半導体装置
Document Type and Number:
Japanese Patent JP6972495
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition that has excellent coating properties and heat resistance, and markedly excellent developability, and a resin sheet with a support, and a multilayer printed board and a semiconductor device using the same.SOLUTION: A resin composition contains a naphthalene type epoxy resin of (1), a photocuring initiator, a compound of (2), and a compound having an ethylenically unsaturated group other than the compound of formula (2).SELECTED DRAWING: None
Inventors:
Kitamura Shinya
Takuya Suzuki
Seiji Seiya
Kumazawa Yune
Takuya Suzuki
Seiji Seiya
Kumazawa Yune
Application Number:
JP2017013288A
Publication Date:
November 24, 2021
Filing Date:
January 27, 2017
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L63/00; C08G59/32; C08K5/103; C09D4/02; C09D7/40; C09D163/00; C09D177/00; H01L23/12; H05K1/03; H05K3/46
Domestic Patent References:
| JP2011256271A | ||||
| JP2015003982A | ||||
| JP2014179388A | ||||
| JP2014205755A | ||||
| JP2015230901A |
Foreign References:
| WO2013176224A1 | ||||
| WO2014087882A1 | ||||
| US20140349120 |
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito