Title:
RESIN COMPOSITION FOR RESIST, METHOD OF FORMING CONDUCTOR PATTERN USING THE SAME, AND METHOD OF MANUFACTURING PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2014011297
Kind Code:
A
Abstract:
To provide a resin composition for a resist, which can be easily dissolved and peeled by an organic solvent, is excellent in etchant resistance and plating liquid resistance, and is capable of forming a fine pattern.
The resin composition for a resist of the present invention is applied by a direct drawing method. The resin composition for a resist contains a polymer (component A) soluble in an organic solvent, a photocurable unsaturated compound (component B), and a photopolymerization initiator (component C). The component B contains at least one (component B1) of a dicyclopentenyloxyethyl acrylate and an isobornyl acrylate, and a (meth)acrylate (component B2) having a hydroxyl group.
Inventors:
KUBO TATSUYA
DOI KATSUO
DOI KATSUO
Application Number:
JP2012146752A
Publication Date:
January 20, 2014
Filing Date:
June 29, 2012
Export Citation:
Assignee:
GOO CHEMICAL CO LTD
International Classes:
H05K3/06; C08F220/18; C08F220/28; H05K3/18
Domestic Patent References:
JP2007316578A | 2007-12-06 | |||
JP2003142801A | 2003-05-16 | |||
JP2007241231A | 2007-09-20 | |||
JP2009235272A | 2009-10-15 | |||
JP2011001461A | 2011-01-06 | |||
JPH07247462A | 1995-09-26 | |||
JP2006245518A | 2006-09-14 | |||
JP2007316578A | 2007-12-06 |
Attorney, Agent or Firm:
Mizuhiji Katsuhisa
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Kyohei Tokioka
Yutaka Kimura
Yoshishige Takeo
Takeshi Sakaguchi
Hidetoshi Kitade
Nakaishi Haruki
Kyohei Tokioka
Yutaka Kimura
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