Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH06271745
Kind Code:
A
Abstract:
PURPOSE: To obtain the subject compsn. excellent in storage stability at high temp. without detriment to the fire resistance and moldability by compounding a specific microcapsulated flame retardant into a compsn. mainly comprising an epoxy resin, a curative, a cure accelerator, and an inorg. filler.
CONSTITUTION: A microcapsulated flame retardant is obtd. by capsulating a halogenated epoxy resin and antimony oxide with a shell material comprising a rubber and an inorg. substance. The objective compsn. is prepd. by compounding 1-15 pts.wt. (based on the resulting compsn.) the flame retardant into a compsn. mainly comprising an epoxy resin, a phenol novolak resin curative, a cure accelerator, and an inorg. filler.
Inventors:
KONDO AKIHIRO
Application Number:
JP5992493A
Publication Date:
September 27, 1994
Filing Date:
March 19, 1993
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08G59/62; C08K3/22; C08K9/10; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K3/22; C08K9/10; H01L23/29; H01L23/31
Domestic Patent References:
| JPH04114028A | 1992-04-15 | |||
| JPS63346A | 1988-01-05 | |||
| JPS55118988A | 1980-09-12 |
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