Title:
RESIN COMPOSITION FOR SEALING SEMICONDUCTOR
Document Type and Number:
Japanese Patent JPH1180510
Kind Code:
A
Abstract:
To obtain a resin composition for semiconductor sealing, capable of carrying out ordinary temperature transportation and ordinary temperature storage and unnecessitating conventional freezing facility and release at ordinary temperature for avoiding moisture absorption.
This resin composition consists essentially of (A) an epoxy resin, (B) a phenol resin curing agent, (C) a curing accelerator and (D) an inorganic filler. In the resin composition, the component A and a part of component, D are melted and kneaded to form powder (E) and the components B and C and residual part of the component D are melted and kneaded to form powder (F) and specific gravity of the powder (F) is [specific gravity of the powder (E)] ±15%.
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Inventors:
AIHARA TAKASHI
Application Number:
JP23818897A
Publication Date:
March 26, 1999
Filing Date:
September 03, 1997
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08G59/62; C08L63/00; H01L23/29; H01L23/31; (IPC1-7): C08L63/00; C08G59/62; C08K3/00; H01L23/29; H01L23/31