Title:
RESIN COMPOSITION FOR SEALING
Document Type and Number:
Japanese Patent JP3317745
Kind Code:
B2
Abstract:
PURPOSE: To obtain the subject compsn. improved in adhesive properties by mixing a dicyanate ester compd. represented by a specific formula and/or its prepolymer, a phenol-modified resin, an epoxy resin, an adhesion improver, and an inorg. filler.
CONSTITUTION: 100 pts.wt. dicyanate ester compd. of formula I (wherein R1 is CH2, a group of formula II, O, S, etc.; and R2 and R3 are each H, CH3, C2H5, or CF3) [e.g. bis(4-cyanatophenyl)methanel and/or its prepolymer is mixed with 5-50 pts.wt. at least one phenol-modified resin selected from the group consisting of a phenol-modified petroleum resin, a phenol-modified coal resin, etc., a tri- or higher functional epoxy resin, 3-30 pts.wt. adhesion improver [e.g. 3-(2H- benzotriazol-2-yl)-1',1',1'-tris(4-hydroxyphenyl)ethane], 0.05-5 pts.wt. cure catalyst, and 100-1,000 pts.wt. inorg. filler (e.g. silica) on a kneader, etc., to give a resin compsn. for sealing a semiconductor. This compsn. is molded and thermally cured to give a molded article having good adhesive properties.
Inventors:
Kenichi Suzuki
Toshiro Takeda
Sumiya Miyake
Naofumi Enoki
Toshiro Takeda
Sumiya Miyake
Naofumi Enoki
Application Number:
JP14340293A
Publication Date:
August 26, 2002
Filing Date:
June 15, 1993
Export Citation:
Assignee:
Sumitomo Bakelite Co., Ltd.
International Classes:
C08G59/40; C08G59/62; C08K3/00; C08K5/3472; C08L9/00; C08L45/00; C08L63/00; C08L79/04; H01L23/29; H01L23/31; H05K3/28; (IPC1-7): C08L79/04; C08K3/00; C08K5/3472; C08L9/00; C08L45/00; C08L63/00
Domestic Patent References:
| JP6256625A | ||||
| JP6136096A | ||||
| JP5339372A | ||||
| JP63113014A | ||||
| JP1158039A |
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