Title:
RESIN COMPOSITION FOR SEALING
Document Type and Number:
Japanese Patent JPH04117453
Kind Code:
A
Abstract:
PURPOSE:To prepare the title compsn. excellent in heat resistance and toughness and having a low water absorptivity by compounding a poly(unsatd. dicarboximide), an alkenylphenol, a polyphenylene ether polymer, and an inorg. filler. CONSTITUTION:A poly(unsatd. dicarboximide) (A) having at least two unsatd. dicarboximide groups in the molecule, an alakenylphenol (B) having at least two alkenyl groups in the molecule, a polyphenylene ether polymer (C) having olefinic groups attached to the arom. rings in the main chain and a number average mol.wt. of 500-5000, and an inorg. filler (D) are compounded in such wt. ratios that A/B is 0.05-20.0, B/C is 0.5-50, and (A+B+C)/D is 0.1-10. giving the title compsn. which gives a cured article excellent in heat resistance and toughness and having a relatively low water absorptivity, being useful for sealing, esp. for semiconductor sealing.
Inventors:
KANAYAMA KAORU
ICHIKAWA SHUJI
TSUKAHARA TORU
ICHIKAWA SHUJI
TSUKAHARA TORU
Application Number:
JP23453190A
Publication Date:
April 17, 1992
Filing Date:
September 06, 1990
Export Citation:
Assignee:
MITSUBISHI PETROCHEMICAL CO
International Classes:
C08K5/13; C08K5/16; C08L71/12; H01L23/29; H01L23/31; (IPC1-7): C08K5/13; C08K5/16; C08L71/12; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Nakaya Moriya