To provide a resin composition for a semiconductor device, excellent in workability, low stress characteristics, moisture resistance, and reflow-peeling resistance, and to provide a semiconductor device with excellent reliability by using the resin composition as a die-attaching paste for semiconductors or an adhesive material for heat dissipation members.

The resin composition includes: (A) a compound prepared by adding maleic anhydride to a polymer containing at least 30 wt.% of a compound represented as a constituent unit by a specific formula (1), CH2=CR1-CR2=CH2(R1, R2are each a hydrogen atom and a 1-6C hydrocarbon group); (B) a compound prepared by reacting polycarbonate diol with a molecular weight of at least 500 to at most 5,000 with (meth)acrylic acid or (meth)acrylate; and (C) a filler.

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