To provide a resin composition which has a sufficiently low stress property, even when used for large area adhesion uses, and exhibits good adhesiveness, and to provide a semiconductor device which uses the resin composition as a die attach material or a heat sink attach material and therefore has excellent reliability.

This resin composition comprising a compound (A) having at least one functional group represented by general formula (1) and a structure represented by general formula (2) is characterized in that R3 in general formula (2) has a 1 to 10C hydrocarbon group or a structure represented by general formula (3). It is preferable that R3 in general formula (2) does not contain an aromatic ring. In general formula (1) R1 is -C2H2- or -C3H4-, in general formula (2) R2 is a 1-10C hydrocarbon group and n is an integer of 1-50, and in formula (3) Z is -O-, -COO- or -OCOO-, R4 is a 3-6C hydrocarbon group and m is an integer of 2-20.