Title:
RESIN COMPOSITION, RESIN SHEET, LAYERED PRODUCT, SEMICONDUCTOR WAFER WITH RESIN COMPOSITION LAYER, SUBSTRATE WITH RESIN COMPOSITION LAYER FOR SEMICONDUCTOR MOUNTING, AND SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2021138953
Kind Code:
A
Abstract:
To provide a resin composition, resin sheet, a layered product, a semiconductor wafer with a resin composition layer, a substrate with a resin composition layer for semiconductor mounting, and a semiconductor device which achieve low voidness, chip adhesion, tackiness, permeability, and flux activity in a balanced manner .SOLUTION: A resin composition comprises a bismaleimide compound (A) comprising a constituent unit represented by formula (1) and maleimide groups at both ends of the molecular chain, a radical-polymerizable resin or compound (B), which is not the bismaleimide compound (A), and a hardening accelerator (C), wherein the radical-polymerizable resin or compound (B) includes at least one group selected from citraconimide, vinyl, maleimide, (meth)acryloyl, and allyl groups.SELECTED DRAWING: None
Inventors:
OKANIWA MASASHI
TAKANO KENTARO
KIDA TAKESHI
TAKANO KENTARO
KIDA TAKESHI
Application Number:
JP2021077677A
Publication Date:
September 16, 2021
Filing Date:
April 30, 2021
Export Citation:
Assignee:
MITSUBISHI GAS CHEMICAL CO
International Classes:
C08L61/34; B32B7/025; C08F222/40; C08G14/12; C08K3/013; C08K5/14; C08K5/3415; C08K5/3445; H01L23/29; H01L23/31
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Kazuhiko Naito
Toshifumi Onuki
Kazuhiko Naito