Title:
RESIN COMPOSITION, SOLDERING RESIST RESIN COMPOSITION AND THEIR CURED BODIES
Document Type and Number:
Japanese Patent JP2002278063
Kind Code:
A
Abstract:
To provide a resin composition giving a cured body excellent in flexibility and resistance to the heat of soldering, heat deterioration and electroless gold plating, developable with an organic solvent or a dilute alkali solution and suitable for a soldering resist and for an interlayer dielectric.
The resin composition contains a urethane oligomer (A) which is a reaction product of a diol compound (a) of the formula HO-C2H4-S-CnH2n-S- C2H4-OH (where (n) is an integer of 2-10) and a tetracarboxylic acid dianhydride (b) and a polyol compound (c) other than the component (a), an organic polyisocyanate (d) and a hydroxyl-containing (meth)acrylate (e) as optional components and a diluent (B).
Inventors:
KOYANAGI TAKAO
OZAKI TORU
YOKOSHIMA MINORU
OZAKI TORU
YOKOSHIMA MINORU
Application Number:
JP2001082028A
Publication Date:
September 27, 2002
Filing Date:
March 22, 2001
Export Citation:
Assignee:
NIPPON KAYAKU KK
International Classes:
G03F7/027; C08F2/50; C08F290/06; C08F299/02; C08G18/42; C08G81/02; H05K1/03; H05K3/28; H05K3/46; (IPC1-7): G03F7/027; C08F2/50; C08F290/06; C08F299/02; C08G81/02; H05K1/03; H05K3/28; H05K3/46