Title:
RESIN COMPOSITION FOR TEMPORARILY FIXING SEMICONDUCTOR WAFER AND METHOD FOR PROCESSING SEMICONDUCTOR WAFER
Document Type and Number:
Japanese Patent JP2017048266
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition for temporary fixing which fixes a semiconductor wafer to a support with a sufficient strength, and can easily separate the semiconductor wafer after processing from a support and a temporarily fixing member, and to provide a method for processing a semiconductor wafer.SOLUTION: A resin composition contains (A) a thermoplastic resin which is a (meth)acrylic copolymer having a reactive group, and has a ratio of acrylonitrile of 20 mass% or less based on the total amount of a copolymer component, (B) a thermosetting resin, (C) a (meth)acrylic monomer, and (D) a compound for generating a base and a radical by irradiation with ultraviolet rays, preferably further contains (E) a silicone compound, and more preferably contains (F) a curing accelerator.SELECTED DRAWING: Figure 1
Inventors:
UENO KEIKO
TOKUYASU TAKAHIRO
ISHII MANABU
YAMAGUCHI YUJI
OYAMA YASUYUKI
TOKUYASU TAKAHIRO
ISHII MANABU
YAMAGUCHI YUJI
OYAMA YASUYUKI
Application Number:
JP2015170667A
Publication Date:
March 09, 2017
Filing Date:
August 31, 2015
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD
International Classes:
C09J131/00; B32B27/30; C08G59/50; C09J4/02; C09J7/02; C09J11/06; C09J163/00; C09J183/04; C09J201/00; H01L21/304