Title:
RESIN COMPOSITION AND THERMOSETTING ADHESIVE SHEET
Document Type and Number:
Japanese Patent JP2023143317
Kind Code:
A
Abstract:
To provide a resin composition which can be formed into a sheet-like form, and can suppress warpage when base materials are bonded and an insulation layer is formed, especially, dissimilar base materials are bonded and an insulation layer is formed, and a thermosetting adhesive sheet having an adhesive layer formed from the resin composition.SOLUTION: A resin composition contains (A) a thermosetting resin, (B) a thermoplastic resin having a glass transition temperature of 50°C or higher, (C) a thermoplastic resin having a glass transition temperature of lower than 50°C, and (D) a curing agent.SELECTED DRAWING: None
Inventors:
OKUNO MANAMI
OHASHI MASARU
OHASHI MASARU
Application Number:
JP2022050633A
Publication Date:
October 06, 2023
Filing Date:
March 25, 2022
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08L101/12; C08G59/00; C09J7/35; C09J163/00; C09J167/00; C09J171/10
Attorney, Agent or Firm:
Hajime Takashima
Mitsuyoshi Kamada
Kyoko Doi
Yaeko Tamura
Hirofumi Taima
Atsuko Akai
Tomiya Tosaki
Mitsuyoshi Kamada
Kyoko Doi
Yaeko Tamura
Hirofumi Taima
Atsuko Akai
Tomiya Tosaki
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