To provide a resin composition having excellent heat-sealability at a low temperature, giving a coating film free from surface stickiness and developing excellent adhesiveness to molded articles of various resins such as polyolefin, synthetic rubber, unsaturated polyester, epoxy resin and urethane resin and metals such as steel plate and aluminum and provide the use of the composition.

The resin composition is composed of an organic solvent, a styrenic elastomer and a polymer of copolymerizable monomers composed of a monomer having an α,β-monoethylenic unsaturated group and other copolymerizable monomer. The Mw of the styrenic elastomer satisfies the formula 200,000<Mw≤700,000.