Title:
樹脂組成物及びその用途
Document Type and Number:
Japanese Patent JP7238099
Kind Code:
B2
Abstract:
This invention provides a material having a low dissipation factor that is suitable for use as an insulating material for a printed wiring board and the like; a resin composition used for the production of the material; and an application using the material. The present invention relates to a resin composition comprising a mono(C6-C20 alkyl)diallyl isocyanurate and a polyphenylene ether resin; a cured product of the resin composition; and use of the cured product.
More Like This:
| JPS63213558 | RESIN COMPOSITION |
| JPS61130368 | SELF-FIRE-EXTINGUISHING THERMOPLASTIC POLYAMIDE MOLDING MATERIAL |
| JP5797710 | Resin composition and its molded product |
Inventors:
Akihito Otsuka
Takashi Kashihara
Aoki Kazunori
Takeshi Kumano
Takashi Kashihara
Aoki Kazunori
Takeshi Kumano
Application Number:
JP2021509571A
Publication Date:
March 13, 2023
Filing Date:
March 26, 2020
Export Citation:
Assignee:
Shikoku Kasei Holdings Co., Ltd.
International Classes:
C08L71/12; B32B5/28; B32B15/08; C08J5/24; C08K5/3492; C09J11/06; C09J171/12; H05K1/03
Domestic Patent References:
| JP2004196958A | ||||
| JP2009299041A | ||||
| JP2008050467A | ||||
| JP2013159624A | ||||
| JP2003160726A | ||||
| JP2016139798A | ||||
| JP2017079293A | ||||
| JP2017511404A | ||||
| JP2015151413A |
Attorney, Agent or Firm:
Saegusa International Patent Office