Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2003034744
Kind Code:
A
Abstract:
To obtain a composition which, when cured, gives a cured product excellent in electrical insulation, adhesion, heat resistance, chemical resistance, weatherability, moisture resistance, adhesion to metals and mechanical strength.
This composition contains a compound having a group represented by the general formula(1) (wherein, R1, R2 and R3 are identical or different and each hydrogen or lower alkyl; X, Y and Z are identical or different and are each oxygen or sulfur and at least two of them are sulfur atoms) and a compound having two or more acidic groups.
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Inventors:
HOTTA IWAO
MURAYAMA SHUNICHI
HAGINO HARUFUMI
MORIYAMA SATOSHI
MURATA SHIGERU
SHIMIZU IKUO
MURAYAMA SHUNICHI
HAGINO HARUFUMI
MORIYAMA SATOSHI
MURATA SHIGERU
SHIMIZU IKUO
Application Number:
JP2002135227A
Publication Date:
February 07, 2003
Filing Date:
May 10, 2002
Export Citation:
Assignee:
KYOWA YUKA KK
International Classes:
C08F20/28; C08K5/09; C08K5/37; C08L33/14; C08L61/00; C08L71/00; C08L101/06; C09D201/06; C09J201/06; C07D327/04; H01L23/29; H01L23/31; (IPC1-7): C08L33/14; C07D327/04; C08F20/28; C08K5/09; C08K5/37; C08L61/00; C08L71/00; H01L23/29; H01L23/31