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Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005060439
Kind Code:
A
Abstract:

To obtain a resin composition imparting flexibility to a resin such as a thermoplastic resin, a thermosetting resin and rubber, especially a resin having a functional group such as hydroxy group, carboxy group, amide group or amino group having reactivity with epoxy group without lowering the melt viscosity and affording a molded product with a slight deviation from designed dimensions by a molding method such as an extrusion method, a blow molding method, an injection molding method, a calender forming method or a press forming method.

This resin composition comprises 1-30 pts. mass of a plasticizer composed of a vinyl polymer having epoxy groups, ≤0°C glass transition temperature, 500-30,000 weight-average molecular weight and 0.50-5.00 milliequivalents/g epoxy value and 100 pts. mass of a resin.


Inventors:
FURUTA MADOKA
KAWAI MICHIHIRO
Application Number:
JP2003207659A
Publication Date:
March 10, 2005
Filing Date:
August 18, 2003
Export Citation:
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Assignee:
TOAGOSEI CO LTD
International Classes:
C08L101/00; C08L67/00; C08L69/00; C08L77/00; (IPC1-7): C08L101/00; C08L67/00; C08L69/00; C08L77/00
Domestic Patent References:
JP2003026882A2003-01-29
JPS6090241A1985-05-21
JP2001098145A2001-04-10
JP2002338817A2002-11-27
JP2001207045A2001-07-31
JPS4713860B1
JP2000178432A2000-06-27
JPH07188551A1995-07-25
JPH01170657A1989-07-05
Foreign References:
WO2001083619A12001-11-08
WO2000064983A12000-11-02