Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2005320373
Kind Code:
A
Abstract:
To provide a polyoxymethylene resin composition which can give a molding having excellent impact resistance as well as unimpaired appearance, to provide a molding thereof, and to provide a part made therefrom.
The resin composition is a polyoxymethylene resin composition wherein (A) the constituent polyoxymethylene resin comprises 100 to 50 wt. % (a-1) hydroxyalkyl-terminated polyoxymethylene copolymer and 0 to 50 wt. % (a-2) oxymethylene resin, 5 to 60 pts.wt. (B) modified olefin polymer and 0 to 10 pts.wt. (C) lubricant are contained per 100 pts.wt. total weight of the above components, and at least 60% of the dispersed particles of component (B) have breadths of at most 3 μm.
Inventors:
KOYAMA ATSUSHI
Application Number:
JP2004137530A
Publication Date:
November 17, 2005
Filing Date:
May 06, 2004
Export Citation:
Assignee:
ASAHI KASEI CHEMICALS CORP
International Classes:
C08J3/20; C08G2/38; C08L59/04; (IPC1-7): C08L59/04; C08G2/38; C08J3/20
Domestic Patent References:
JP2002138185A | 2002-05-14 | |||
JPH07207115A | 1995-08-08 | |||
JP2004323713A | 2004-11-18 | |||
JPH06200117A | 1994-07-19 | |||
JPH10130458A | 1998-05-19 | |||
JP2002256134A | 2002-09-11 | |||
JP2001064479A | 2001-03-13 |
Foreign References:
WO2000017247A1 | 2000-03-30 |