Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2013107934
Kind Code:
A
Abstract:

To provide a resin composition which can reduce warpage upon curing, is excellent in insulation reliability and can be suitably used as material of surface protective film and interlayer insulation film of semiconductor element, and protective insulation film and interlayer insulation film for printed-wiring board, to provide a resin film using the resin composition and to provide a wiring board using the resin composition and the resin film.

The resin composition includes: a polymer compound (A) obtained by polymerizing a tetracarboxylic dianhydride component and a diamine component which has polyether structure and at least two terminal amine structure; and an antioxidant (B), wherein the polymer compound has not ester structure and sulfonic acid group in the molecule.


More Like This:
WO/2013/105611AGGREGATE CONTAINING POLYIMIDE POWDER AND POLYIMIDE PRECURSOR, METHOD FOR PRODUCING SAME, AND POLYIMIDE MOLDED BODY USING SAME
JPH03281540COMPOSITE PARTICLE CONTAINING POLYIMIDE STRUCTURE UNIT AND FILLER NUCLEUS
Inventors:
KIDA YUSUKE
ADACHI HIROAKI
IIZUKA YASUSHI
Application Number:
JP2011251841A
Publication Date:
June 06, 2013
Filing Date:
November 17, 2011
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
ASAHI KASEI E MATERIALS CORP
International Classes:
C08L79/08; C08G73/10; C08K5/00; H05K3/46
Domestic Patent References:
JP2010077382A2010-04-08
JP2009258367A2009-11-05
JP2005307148A2005-11-04
JPH10195195A1998-07-28
JP2010009052A2010-01-14
JP2009124126A2009-06-04
JP2010077382A2010-04-08
JP2009258367A2009-11-05
Foreign References:
WO2010143667A12010-12-16
WO2010143667A12010-12-16
Attorney, Agent or Firm:
Hiroyoshi Aoki
Amada Masayuki



 
Previous Patent: RESIN COMPOSITION FOR OPTICAL MOLDED ARTICLE, METHOD FOR PRODUCING THE SAME AND OPTICAL MOLDED ARTIC...

Next Patent: METHOD FOR PRODUCING CELLULOSE SOLUTION