Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2018002886
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin composition capable of providing an insulating layer excellent in flame retardancy, a peel strength between the resin composition and a conductor layer and reflow resistance; and a resin sheet, a circuit board, a semiconductor chip package and a semiconductor device each using the same.SOLUTION: The resin composition is provided that contains: a compound (a) having a butadiene structural unit (i) which may be hydrogenated and one or more structural units (ii) selected from the group consisting of a biphenylene type phenolic structural unit and a naphthol aralkyl unit; an epoxy resin (b)having two or more epoxy groups and one or more aromatic rings in one molecule; and an inorganic filler (c), the content of the inorganic filler (c) being 30 mass% or more when a nonvolatile component of the resin composition is 100 mass%.SELECTED DRAWING: None
Inventors:
NAKAMURA SHIGEO
Application Number:
JP2016131902A
Publication Date:
January 11, 2018
Filing Date:
July 01, 2016
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08L9/00; C08K3/00; C08L15/00; C08L61/00; C08L63/00; C08L71/12; H01L23/14; H05K1/03
Attorney, Agent or Firm:
Sakai International Patent Office
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