Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3458897
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin compsn. excellent in mechanical property, thermal property, electrical property, and fluidity during molding, and has extremely high light reflectivity.
SOLUTION: This compsn. comprises 100 pts.wt. compsn. (A) comprising 5-60 wt.% at least one polymer selected from a styrene polymer (a1) and an oligomer and 95-40 wt.% aromatic polycarbonate (a2), 3-25 pts.wt. titanium oxide (B) having a particle diameter of 0.1-5 μm, and 0.05-7 pts.wt. coupling agent (C) selected form a silane coupling agent and an aluminum coupling agent.
Inventors:
Toshiaki Okuzono
Shinya Miya
Noriaki Honda
Hisayuki Kuwahara
Shinya Miya
Noriaki Honda
Hisayuki Kuwahara
Application Number:
JP2000225214A
Publication Date:
October 20, 2003
Filing Date:
March 08, 1994
Export Citation:
Assignee:
Mitsubishi Gas Chemical Co., Ltd.
International Classes:
C08L69/00; C08K3/22; C08K5/00; C08K5/54; C08K5/541; C08K5/56; C08L25/00; C08L25/04; C08L25/12; C08L51/04; C08L55/02; (IPC1-7): C08L69/00; C08K3/22; C08K5/541; C08K5/56; C08L25/00; C08L51/04; C08L55/02
Domestic Patent References:
| JP5239349A |