Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP5381764
Kind Code:
B2
Abstract:
[Issue] A resin composition is provided for forming a resin of an insulating layer of multilayered printed circuit boards to have excellent adherence with the conducting layer after an environmental test is accelerated. [Solution means] A resin composition for multilayered printed circuit boards comprises: (A) cyanate resin, (B) epoxy resin, (C) thermoplastic resin, (D) talc, and (E) silica. When the non-volatile constituent in the resin composition is 100 percent by mass, the total content of the constituent (D) and the constituent (E) is 35 percent by mass to 60 percent by mass, and the content of the constituent (D) as talc is 5 percent by mass to 20 percent by mass.
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Inventors:
Seiichiro Ohashi
Yokota Tadahiko
Shigeo Nakamura
Yokota Tadahiko
Shigeo Nakamura
Application Number:
JP2010023184A
Publication Date:
January 08, 2014
Filing Date:
February 04, 2010
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; C08J5/18; C08J5/24; C08K3/34; C08K9/00; C08L79/00; C08L101/00; H05K1/03
Domestic Patent References:
| JP2005162787A | ||||
| JP2009079073A | ||||
| JP2009024056A |
Attorney, Agent or Firm:
Takashima Ichi
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Kenji Yamamoto
Murata Miyuki
Kyoko Doi
Mitsunori Kamata
Yaeko Tamura
Kenji Yamamoto
Murata Miyuki
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