Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6897026
Kind Code:
B2
Abstract:
Provided are: a resin composition which is suppressed in warpage, and excellent in strength and adhesiveness; and a resin sheet, a circuit board, and a semiconductor chip package using the same. The present invention relates to the resin composition comprising (A) an elastomer having a polycarbonate structure in a molecule, (b) an epoxy resin, (c) an inorganic filler, (d) a phenoxy resin, and (e) a carbodiimide compound.
Inventors:
Hiroyuki Sakauchi
Application Number:
JP2016157725A
Publication Date:
June 30, 2021
Filing Date:
August 10, 2016
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L75/06; C08G18/10; C08G59/40; C08K5/29; C08L63/00; C08L71/10; H01L23/14; H01L23/29; H01L23/31; H05K3/28
Domestic Patent References:
| JP2011094037A | ||||
| JP2012136693A |
Attorney, Agent or Firm:
Takashima Ichi
Mitsunori Kamata
Hirofumi Toma
Shigehisa Takayama
Mitsunori Kamata
Hirofumi Toma
Shigehisa Takayama