Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6939564
Kind Code:
B2
Abstract:
The present invention provides a resin composition having a high sensitivity and serving to produce a cured film with a low water absorption rate. The resin composition includes: (a) an alkali-soluble resin and (b1) an amido-phenol compound containing a phenolic hydroxyl group in which a monovalent group as represented by the undermentioned general formula (1) is located at the ortho position and/or (b2) an aromatic amido acid compound containing a carboxy group in which a monovalent group as represented by the undermentioned general formula (2) is located at the ortho position:wherein in general formula (1), X is a monovalent organic group having an alkyl group that contains 2 to 20 carbon atoms and bonds directly to the carbonyl carbon in general formula (1) or a monovalent organic group that has —(YO)n—; and in general formula (2), U is a monovalent organic group that has an alkyl group containing 2 to 20 carbon atoms and bonding directly to the amide nitrogen in general formula (2) or a monovalent organic group that has —(YO)n—; wherein Y is an alkylene group containing 1 to 10 carbon atoms and n is an integer of 1 to 20.
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Inventors:
Yumori Komori
Ichito Miyoshi
Ichito Miyoshi
Application Number:
JP2017554412A
Publication Date:
September 22, 2021
Filing Date:
July 25, 2017
Export Citation:
Assignee:
TORAY INDUSTRIES,INC.
International Classes:
C08L101/12; C08K5/20; C08L79/04; C08L79/08; G03F7/20; G09F9/00; G09F9/30; H01L27/32; H01L51/50; H05B33/10; H05B33/22
Domestic Patent References:
| JP2000131845A | ||||
| JP2001183835A |
Attorney, Agent or Firm:
Seiryu International Patent Service Corporation
Takayoshi in the daytime
Masao Sakaizawa
Takayoshi in the daytime
Masao Sakaizawa