Title:
樹脂組成物
Document Type and Number:
Japanese Patent JP6992333
Kind Code:
B2
Abstract:
Provided are: a resin composition which has a low melt viscosity and is capable of obtaining an insulating layer having high adhesion to a conductor layer after a HAST test; a resin sheet which contains the resin composition; a printed wiring board which is provided with an insulating layer formed from the resin composition; and a semiconductor device. A resin composition comprising (A) an epoxy resin and (B) a maleimide compound, the component (B) comprising at least one of an alkyl group having 5 or more carbon atoms and an alkylene group having 5 or more carbon atoms.
Inventors:
Kenji Kawai
Application Number:
JP2017171435A
Publication Date:
January 13, 2022
Filing Date:
September 06, 2017
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/38; C08K13/02; H05K1/03
Domestic Patent References:
| JP2016131243A | ||||
| JP2016196549A | ||||
| JP2016210851A | ||||
| JP2010090238A | ||||
| JP2018090728A | ||||
| JP2017043767A | ||||
| JP2016196635A |
Attorney, Agent or Firm:
Sakai International Patent Office