Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05339494
Kind Code:
A
Abstract:
PURPOSE:To obtain the subject composition capable of producing a molded resin material exhibiting a high strength stiffness and a low water absorption and excellent in visual appearance by blending a resin mixture composed of a half-aromatic polyamide resin and a polyphenylene ether resin with a modified styrene-based polymer. CONSTITUTION:The objective composition is obtained by blending (A) 5 to 95wt.% half aromatic polyamide resin composed of (i) 20 to 95wt.% hexamethylene adipamide unit synthesized from adipic acid and hexamethylenediamine, (ii) 0 to 40wt.% hexamethylene terephthalamide unit synthesized from terephthalic acid and hexamethylenediamine and (iii) 5 to 40wt.% hexamethylene isophthalamide unit synthesized from isophthalic acid and hexamethylenediamine with (B) 5 to 95wt.% polyphenylene ether and adding (C) 0 to 50 pts.wt. modified styrene-based polymer synthesized by grafting (v) an alpha,beta-unsaturated carboxylic acid or its derivative on (iv) a styrene-based polymer to 100 pts.wt. the resultant resin mixture composition.
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Inventors:
NISHINO HIROSHI
Application Number:
JP14744292A
Publication Date:
December 21, 1993
Filing Date:
June 08, 1992
Export Citation:
Assignee:
ASAHI CHEMICAL IND
International Classes:
C08L51/00; C08L71/12; C08L77/00; C08L77/06; (IPC1-7): C08L71/12; C08L51/00; C08L77/06
Attorney, Agent or Firm:
Hidetake Komatsu (2 outside)