Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH0593120
Kind Code:
A
Abstract:
PURPOSE:To prepare a resin compsn. excellent in heat resistance, impact strength, flame retardance, and moldability by compounding a heat-resistant resin, a thermoplastic resin, antimony oxide, a brominated epoxy compd., specific reaction products, and a silicone oil. CONSTITUTION:100 pts.wt. resin component comprising a heat-resistant resin selected from the group consisting of a styrenic compd.-imide compd. copolymer and a rubber-reinforced copolymer and a thermoplastic resin selected from the group consisting of a copolymer obtd. by grafting styrene and methyl methacrylate onto a rubber component, an AS resin, and an MS resin is compounded with 0.5-10 pts.wt. antimony oxide, 5.0-40 pts.wt. the sum of a brominated epoxy compd., a brominated epoxy compd. having both molecular terminals reacted with 2,4,6-tribromophenol, and an acrylonitrile-butadiene copolymer having both molecular terminals carboxylated, and 0.1-3.0 pts.wt. silicone oil.
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Inventors:
MAEDA HIROYUKI
MACHIDA MITSUNOBU
NAKAMURA TERUO
AOYAMA TSUTOMU
WASHIYAMA JUNICHIRO
MACHIDA MITSUNOBU
NAKAMURA TERUO
AOYAMA TSUTOMU
WASHIYAMA JUNICHIRO
Application Number:
JP25538891A
Publication Date:
April 16, 1993
Filing Date:
October 02, 1991
Export Citation:
Assignee:
SHOWA DENKO KK
International Classes:
C08K3/20; C08G59/00; C08G59/30; C08K3/00; C08L25/00; C08L25/08; C08L51/00; C08L51/04; C08L51/06; C08L59/00; C08L63/00; C08L73/00; C08L81/00; C08L83/04; (IPC1-7): C08K3/20; C08L25/08; C08L51/00; C08L51/04; C08L51/06; C08L63/00; C08L81/00; C08L83/04
Attorney, Agent or Firm:
Minoru Terada