Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH10182986
Kind Code:
A
Abstract:
To obtain a resin composition that can increase the mechanical strength of molding products, reduce the deterioration in its physical properties after a thermo-hygrostat test and is useful as parts for vehicles and electric appliances and as a building material by using an inorganic filler, a thermoplastic resin and a specific phosphorus compound.
This resin composition contains (A) a phosphorus compound bearing a double bond in the molecule, for example, 4-acryloxybutyl dihydrogen phosphate, (B) an inorganic filler with an aspect ratio of 5-200 and (C) a thermoplastic resin with a solubility parameter of 9.0-12.0 such as polyester, polycarbonate, ABS resin or poly(phenylene ether).
Inventors:
TANAKA SUKEYUKI
SHINKO YASUNORI
SHINKO YASUNORI
Application Number:
JP34844996A
Publication Date:
July 07, 1998
Filing Date:
December 26, 1996
Export Citation:
Assignee:
AJINOMOTO KK
International Classes:
C08K3/00; C08K5/521; C08K7/04; C08K9/04; C08L101/00; (IPC1-7): C08L101/00; C08K3/00; C08K5/521; C08K7/04; C08K9/04
Domestic Patent References:
JPS57128728A | 1982-08-10 | |||
JPH0881640A | 1996-03-26 | |||
JPH03166251A | 1991-07-18 | |||
JPH08193157A | 1996-07-30 | |||
JPH023454A | 1990-01-09 |
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