Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH11181181
Kind Code:
A
Abstract:
To obtain a resin composition which exhibits good molding processibility in injection molding and so on and is excellent in heat resistance, mechanical strength and antistatic properties.
This resin composition comprises (a) 100 pts.wt. of a polypropylene resin, (b) 40-60 pts.wt. of a glassfiber, (c) 30-50 pts.wt. of an inorganic filler, (d) 10-90 pts.wt. of a carbon black and/or a carbon fiber and (e) 0.5-20 pts.wt. of a modified polypropylene resin.
Inventors:
CHUMA TOSHIAKI
Application Number:
JP35692397A
Publication Date:
July 06, 1999
Filing Date:
December 25, 1997
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08K3/00; C08K3/04; C08K7/06; C08K7/14; C08L23/10; (IPC1-7): C08L23/10; C08K3/00; C08K3/04; C08K7/06; C08K7/14