Title:
RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPS578253
Kind Code:
A
Abstract:
PURPOSE: To provide a compsn. having low slipperiness and low hot compressibility which is suitable for mica bond for commutators, consisting of shellac, a bisphenol A type epoxy resin, a cyclic aliph. epoxy resin, methylolmelamine and a boron trifluoride complex compd.
CONSTITUTION: 100pts.wt. Shellac, 2W40pts.wt. bisphenol A type epoxy resin, 2W 50pts.wt. cyclic aliph. epoxy resin, 1W15pts.wt. methylolmelamine or an alcohol ether thereof, and 0.05W2pts.wt. boron trifluoride complex compd. (e.g. BF3- triphenylphosphin complex), are blended together to produce the desired resin compsn.
Inventors:
ONO HIROSHI
OOSHIMA MEGUMI
OOSHIMA MEGUMI
Application Number:
JP8484080A
Publication Date:
January 16, 1982
Filing Date:
June 19, 1980
Export Citation:
Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
C08L93/00; C08G59/00; C08G59/50; C08G59/68; C08G59/72; C08L63/00; C08L93/02; (IPC1-7): C08G59/50; C08G59/72; C08L63/00; C08L93/02