Title:
樹脂組成物、硬化物、樹脂シート、回路基板、半導体チップパッケージ、半導体装置、及び構造体
Document Type and Number:
Japanese Patent JP7367664
Kind Code:
B2
Abstract:
An object of the present invention is to improve the resolution of the layers of a photosensitive resin composition formed on a cured product layer of a resin composition. The resin composition contains an epoxy resin; at least one curing agent selected from the group consisting of an acid anhydride curing agent, an amine curing agent, and a phenol curing agent; and an inorganic filler. The solution of the present invention is to set the surface roughness of the layer of the photosensitive resin composition in a specific range in a specific evaluation test in which a layer of the photosensitive resin composition is formed on the polished surface of the cured product of the resin composition, and the difference TTV between the maximum thickness and the minimum thickness of the layer of the photosensitive resin composition is set within a specific range.
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Inventors:
Hiroyuki Sakauchi
Sei Sasaki
Sei Sasaki
Application Number:
JP2020208835A
Publication Date:
October 24, 2023
Filing Date:
December 16, 2020
Export Citation:
Assignee:
AJINOMOTO CO.,LTD.
International Classes:
C08L63/00; B32B27/38; C08G59/40; C08K3/013; G03F7/004; G03F7/023; G03F7/031; G03F7/032; G03F7/038; G03F7/075; G03F7/40; H01L23/12; H01L23/14; H01L23/29; H01L23/31; H05K1/03
Foreign References:
| WO2019073763A1 |
Attorney, Agent or Firm:
Sakai International Patent Office
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