Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
RESIN COMPOSITION, FIBER MATERIAL, AND MOLDING MATERIAL
Document Type and Number:
Japanese Patent JP2023152060
Kind Code:
A
Abstract:
To provide a resin composition from which a molding material excellent in adhesion and mechanical strength such as bending strength can be obtained, a fiber material, and a molding material.SOLUTION: A resin composition contains an epoxy resin, and a maleic anhydride-acrylic copolymer, where the epoxy equivalent of the epoxy resin is 150-300 g/eq. and the acid value of the maleic anhydride-acrylic copolymer is 100-500 mgKOH/g, and a content ratio (mass ratio) of the epoxy resin to the maleic anhydride-acrylic copolymer is 20/80 to 80/20.SELECTED DRAWING: None

Inventors:
KAJIKAWA MASAHIRO
KIMURA YOSHINOBU
Application Number:
JP2022061995A
Publication Date:
October 16, 2023
Filing Date:
April 01, 2022
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
DAINIPPON INK & CHEMICALS
International Classes:
C08J5/06; C08L63/00; C08K3/04; C08K7/02; C08L35/00; D06M15/263; D06M15/55
Attorney, Agent or Firm:
Patent Attorney Corporation Junias International Patent Office



 
Previous Patent: Rebar tying machine and reel

Next Patent: Driving support device