Title:
RESIN COMPOSITION, MULTILAYER SHEET, PACKAGING MATERIAL AND CONTAINER
Document Type and Number:
Japanese Patent JP2021195512
Kind Code:
A
Abstract:
To provide a resin composition which enables production of a molding that suppresses occurrence in spitting in melt-molding, has sufficient heat resistance and light resistance, and is less likely to be converted into micro plastic after disposal, and sufficiently improves each of the above characteristics compared to a resin composition using an ethylene-vinyl alcohol copolymer (EVOH).SOLUTION: A resin composition contains EVOH (A) and an aluminum ion (B). At least a part of the EVOH (A) has at least one of a carboxylic acid unit (I) and a lactone ring unit (II) positioned at a polymer terminal. The total content (i+ii) of the carboxylic acid unit (I) and the lactone ring unit (II) per 1 g of the EVOH (A) is 14 μmol/g or more and 78 μmol/g or less, and a content (b) of the aluminum ion (B) per 1 g of the EVOH (A) is 0.002 μmol/g or more and 0.17 μmol/g or less.SELECTED DRAWING: None
Inventors:
OSHITA TAMAKO
NONAKA YASUHIRO
NONAKA YASUHIRO
Application Number:
JP2020105383A
Publication Date:
December 27, 2021
Filing Date:
June 18, 2020
Export Citation:
Assignee:
KURARAY CO
International Classes:
C08L29/04; B32B27/28; B65D1/00; B65D65/40; C08F8/12; C08J5/18; C08K5/098
Domestic Patent References:
| JP6719031B1 | 2020-07-08 | |||
| JP2018150529A | 2018-09-27 | |||
| JP2018075817A | 2018-05-17 |
Foreign References:
| WO2018116765A1 | 2018-06-28 |
Attorney, Agent or Firm:
Hajime Amano