Title:
樹脂組成物、樹脂シート、及び半導体装置
Document Type and Number:
Japanese Patent JP6940508
Kind Code:
B2
Abstract:
A resin composition which comprises a thermally curable component, a thermoplastic resin, a filler, and a triazine compound, wherein the triazine compound is represented by general formula (1). In general formula (1), R1 is a hydrogen atom or an alkyl group, R2 is a hydrogen atom or an alkyl group, and X is a group comprising any group selected from the group consisting of alkyl, phenyl, hydroxyl, alkoxy, and alkoxysilyl groups.
Inventors:
Yasuki Karasawa
Application Number:
JP2018537069A
Publication Date:
September 29, 2021
Filing Date:
August 04, 2017
Export Citation:
Assignee:
LINTEC CORPORATION
International Classes:
C08L101/00; C08K3/013; C08K3/36; C08K5/3492; C08L63/00; C08L71/10; C09J7/00; C09J11/00; C09J11/06; C09J163/00; C09J171/10; C09J201/00; H01L23/29; H01L23/31
Domestic Patent References:
| JP2005089629A | ||||
| JP2010168470A | ||||
| JP2015131772A | ||||
| JP2016034906A | ||||
| JP2016065012A | ||||
| JP2013023667A |
Foreign References:
| WO2010087526A1 | ||||
| WO2016009730A1 |
Attorney, Agent or Firm:
Intellectual Property Office