Title:
樹脂硬化装置及び樹脂硬化方法
Document Type and Number:
Japanese Patent JP7041705
Kind Code:
B2
Abstract:
Provided is a resin curing device capable of improving work efficiency when curing a liquid resin. A controller (2) of a resin curing device (1) controls opening degrees of three valves (51 to 53) so that a gas flow passage becomes a circulation passage (40) when an execution condition of an operation of feeding air to a curing furnace (10) is satisfied, and controls the opening degrees of the three valves (51 to 53) so that the gas flow passage becomes a bypass passage (41) when the execution condition is not satisfied (STEPS 30 to 41).
Inventors:
Naoki Yamamoto
Takahashi Shinju
Takahashi Shinju
Application Number:
JP2020047676A
Publication Date:
March 24, 2022
Filing Date:
March 18, 2020
Export Citation:
Assignee:
Honda motor industry stock company
International Classes:
B29C35/04
Domestic Patent References:
| JP2070769U | ||||
| JP2012110810A | ||||
| JP7265631A |
Attorney, Agent or Firm:
Creation International Patent Office