Title:
RESIN ENCAPSULATING APPARATUS AND METHOD
Document Type and Number:
Japanese Patent JP3897565
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a resin encapsulating apparatus which is capable of making resin fed to cavity recesses, which are arranged in a matrix form for compression molding, uniform in amount so as not to waste encapsulating resin and improving the molding quality of a molded body.
SOLUTION: The parting face of a molding die 1, where cavity recesses 4 are arranged in a matrix form is covered with a release film 5, a sheet resin 6 is fed to the cavity recesses 4 covered with the release film 5, a circuit board 8, where semiconductor chips 7 are arranged in the same matrix form as the cavity recesses 4, is placed on the sheet resin 6, and the circuit board 8 is clamped by the molding die 1 for compression molding.
Inventors:
Junji Hirano
Application Number:
JP2001327654A
Publication Date:
March 28, 2007
Filing Date:
October 25, 2001
Export Citation:
Assignee:
Apic Yamada Corporation
International Classes:
B29C43/18; H01L21/56; B29C43/34; B29K105/20; B29L31/34; (IPC1-7): H01L21/56; B29C43/18; B29C43/34; //B29K105:20; B29L31:34
Domestic Patent References:
| JP2000167841A | ||||
| JP8023005A | ||||
| JP7201900A |
Attorney, Agent or Firm:
Takao Watanuki
Horimai Kazuharu
Horimai Kazuharu
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