Title:
RESIN FILM MOLDER
Document Type and Number:
Japanese Patent JPH07195487
Kind Code:
A
Abstract:
PURPOSE: To provide an apparatus for molding a film and sheet which are free from a high lug even for polypropylene, vinyl acetate ethylene, etc.
CONSTITUTION: A resin film molder is equipped with a T die 1 wherein lower parts 7a, 8a of a T form extruding die 1 are respectively tapered toward near an extrusion opening 4 of resin, a cooling roll for cooling an extruded resin film 12, and a nip roll 3 for pressuring by pinching the resin film 12 between that and the cooling roll. A length of an air gap 6 formed between a lower end of the extrusion opening 4 of resin of the T die 1 and a contact part 5 of the cooling roll 2 with the nip roll 3, is 40-90mm.
Inventors:
MAEJIMA MOKICHI
Application Number:
JP34938893A
Publication Date:
August 01, 1995
Filing Date:
December 28, 1993
Export Citation:
Assignee:
JOHOKU SEIKOSHO KK
International Classes:
B29C43/46; B29C47/88; B29C48/305; B29C69/02; B29D7/00; B29K23/00; B29L7/00; (IPC1-7): B29C47/14; B29C47/88; B29C69/02; B29D7/00
Attorney, Agent or Firm:
Tatsuo Ito (1 outside)