Title:
RESIN-LAMINATED MOLDING FOR POLISHING
Document Type and Number:
Japanese Patent JP2015223632
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin-laminated molding for polishing where abrasive grains are homogeneously dispersed without the variation of a filling amount when being highly charged into the laminated molding (fiber-reinforced plastic) while maintaining mechanical strength such as shock resistance and the like as a machine component and mass productivity (the maintainability of facilities and an apparatus) is considered.SOLUTION: A prepreg is made by impregnating a thermosetting resin varnish into a nonwoven fabric with abrasive grains where an abrasive grain filling material consisting of at least one kind among silicon carbide abrasive grains and alumina abrasive grains adheres to the nonwoven fabric. The blending amount of the nonwoven fabric with the abrasive grains is 60-90 wt.% and the blending amount of the solid component of the thermosetting resin varnish is 10-40 wt.%. A plurality of prepregs are laminated and performed with press heating and then the abrasive grains are homogeneously dispersed. The nonwoven fabric is made of a polyamide resin and a thermosetting resin is made of at least one or more kinds selected from among epoxies and phenols.
Inventors:
MATSUMOTO TAKESHI
NISHIURA KOICHI
NISHIURA KOICHI
Application Number:
JP2014107720A
Publication Date:
December 14, 2015
Filing Date:
May 26, 2014
Export Citation:
Assignee:
STARLITE IND
International Classes:
B24D3/28; B24D3/00; B24D11/00
Domestic Patent References:
| JP2000265349A | 2000-09-26 | |||
| JP2003011068A | 2003-01-15 | |||
| JPH0429361U | 1992-03-09 | |||
| JPS61154667U | 1986-09-25 |
Attorney, Agent or Firm:
Takao Yanagino
Norio Morioka
Hisayoshi Sekiguchi
Masato Nakagawa
Norio Morioka
Hisayoshi Sekiguchi
Masato Nakagawa
Previous Patent: DRAWING UNIT AND METHOD CORRESPONDING TO THE SAME
Next Patent: ELECTRODEPOSITION REAMER
Next Patent: ELECTRODEPOSITION REAMER