To provide a resin optical component having heat resistance in which a camera module integrating a semiconductor with a lens is mounted in the reflow process, having a high Abbe number comparable to glass, and excellent in bending strength; and to provide an optical resin composition excellent in mold releasability suitable for mold-molding the component.

This optical resin composition includes a silsesquioxane derivative obtained by hydrolytic condensation of (a) a trialkoxysilane having a 1-12C alkyl group or 6-12C aryl group and (b) a trialkoxysilane having an epoxy group in a mole ratio of 1:99 to 90:10, with a weight-average molecular weight of 1,000-30,000 and containing 70 wt.% or more of a random type structure and/or a ladder type structure; an epoxy resin containing an alicyclic skeleton; and a curing agent. The optical component is obtained by curing the optical resin composition and has 55 or more of an Abbe number.