Title:
RESIN MATERIAL AND MULTILAYER PRINTED WIRING BOARD
Document Type and Number:
Japanese Patent JP2021025051
Kind Code:
A
Abstract:
To provide a resin material capable of achieving low dielectric loss tangent, high thermal dimensional stability, high desmearing capability due to desmear processing, small surface roughness after etching and high plating peel strength.SOLUTION: There is provided a resin material containing a specific cyclohexane ring-containing compound and a curing accelerator, wherein the cyclohexane ring-containing compound has a first skeleton derived from an aliphatic diamine compound having a cyclohexane ring and a second skeleton derived from a dimer diamine. The aliphatic diamine compound having a cyclohexane ring is different from a dimer diamine. The average ratio of the first skeleton is 50 mol% or more and 85 mol% or less and the average ratio of the second skeleton is 15 mol% or more and 50 mol% or less based on 100 mol% of the whole structural unit of the skeleton derived from a diamine compound in the cyclohexane ring-containing compound.SELECTED DRAWING: Figure 1
Inventors:
KAWAHARA YUKO
KUBO AKIKO
ARAI YOSHITO
HAYASHI TATSUJI
TAKEDA KOHEI
NIIDO MASAMI
DAITO YUTA
KUBO AKIKO
ARAI YOSHITO
HAYASHI TATSUJI
TAKEDA KOHEI
NIIDO MASAMI
DAITO YUTA
Application Number:
JP2020130791A
Publication Date:
February 22, 2021
Filing Date:
July 31, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD
International Classes:
C08L79/08; B32B15/08; C08G59/40; C08G73/10; C08K3/36; C08L63/00; C08L101/00; H05K1/03
Attorney, Agent or Firm:
Patent business corporation Miya saki, table of contents patent office