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Title:
RESIN MOLD APPARATUS AND RESIN MOLDING METHOD
Document Type and Number:
Japanese Patent JP2000309040
Kind Code:
A
Abstract:

To provide a simple mold having an ejector means provided outside the mold and satisfying conditions of a small number of lots, the short appointed date of delivery and low cost by communizing and simplifying.

In an injection mold, a molten resin is charged in the cavity formed by a fixed mold and a movable mold 2 and cooled and solidified to be molded into a molded article 3. The fixed mold or movable mold 2 to which the molded article 3 is adhered mounted in the injection mold is taken out of the injection mold by the hand 405 of the ejector means provided in the vicinity of the injection mold to be fed onto the fixed stand 401 of the ejector means and the fixed mold or movable mold 2 is pressed to the fixed stand 401 and cores 4c, 4d are ejected to eject and release the molded article 3 adhered to the fixed mold or movable mold 2.


Inventors:
HASEGAWA MICHIHIKO
Application Number:
JP29002099A
Publication Date:
November 07, 2000
Filing Date:
October 12, 1999
Export Citation:
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Assignee:
SANYO ELECTRIC CO
International Classes:
B29C45/40; B29C33/38; B29C33/44; B29C45/37; (IPC1-7): B29C45/40; B29C33/38; B29C33/44; B29C45/37
Attorney, Agent or Firm:
Masano Shibano



 
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