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Title:
RESIN MOLD ELECTRIC APPARATUS
Document Type and Number:
Japanese Patent JPH0969321
Kind Code:
A
Abstract:

To acquire electric field relaxation property and crack resistance by making the vicinities of both ends of a metallic parts have R parts, and besides, bonding conductive rubber tapes to the vicinities, in resin mold part where cylindrical or columnar metal is buried.

(a) shows the cross section of a mold part used for an insulating spacer, etc., and (b) shows the magnified view of its one part. This resin mold electric apparatus is one where both ends of the metallic insert 2 constituting the buried metal are provided with R parts (R-shaped projections) 1 for relaxation of electric fields, and conductive rubber tapes 4 are bonded to the vicinities, and are molded with mold resin 3. For the conductive tape 4, resin is bonded in advance prior to molding resin. Hereby, the deformation of the mold resin 3 around the conductive rubber tape 4 becomes possible, and the residual stress of the mold resin, which occurs in the vicinity of the round part of the metallic insert 2, can be made small, so cracks do not occur even under severe environment for use.


Inventors:
YOSHIOKA KANJI
KOYAMA MICHIHIKO
KAGAWA YOSHIHIRO
OYAMADA MITSURU
MIYAGAWA MASARU
Application Number:
JP22383195A
Publication Date:
March 11, 1997
Filing Date:
August 31, 1995
Export Citation:
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Assignee:
TOSHIBA CORP
International Classes:
H01F27/32; H01B17/26; H01B19/00; (IPC1-7): H01B19/00; H01B17/26
Attorney, Agent or Firm:
Inomata Shoaki



 
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