Title:
RESIN MOLDING APPARATUS USING LAPPING RESIN
Document Type and Number:
Japanese Patent JP3246847
Kind Code:
B2
Abstract:
PURPOSE: To prevent the winding-up of a lapping film in a pot, to enable the highly reliable molding of a resin and to easily remove a cured resin from the pot.
CONSTITUTION: In a resin molding apparatus using a lapping resin supplying the lapping resin wherein a resin is hermetically sealed with lapping films 10a, 10b to a pot 14 to send the same under pressure by a plunger 24 to mold the resin, the resin pressing end part of the plunger 24 is formed into a taper part 24a and a taper surface 14a is formed to the inner surface of the pot 14.
Inventors:
Fumio Miyajima
Application Number:
JP3035395A
Publication Date:
January 15, 2002
Filing Date:
February 20, 1995
Export Citation:
Assignee:
Apic Yamada Co., Ltd.
International Classes:
B29C45/26; B29C45/02; B29C45/14; H01L21/56; B29L31/34; (IPC1-7): B29C45/02; B29C45/14; H01L21/56
Domestic Patent References:
| JP63111021A | ||||
| JP601834A | ||||
| JP2191111A | ||||
| JP5200769A | ||||
| JP62131435U |
Attorney, Agent or Firm:
Takao Watanuki (1 outside)
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