Title:
RESIN MOLDING APPARATUS
Document Type and Number:
Japanese Patent JP2015051555
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding apparatus which, when producing a structure where a part of a semiconductor chip is exposed from a mold resin by bringing a part of a mold into contact with the semiconductor chip, can mold the mold resin in a state where the inclination of a part of the mold brought into contact with the semiconductor chip is corrected.SOLUTION: A mold includes a lower mold 10 in which a workpiece 50 is arranged, and an upper mold 20 where the workpiece 50 is arranged in a space 60 formed between it and the lower mold 10 by being combined with the lower mold 10. The mold also includes a piece mold 30 which is arranged in a window part 21 installed in the upper mold 20 so as to project from a wall surface 22 of the upper mold 20 and has a contact surface 31 brought into contact with an exposed part 56 of a semiconductor chip 53. In such a configuration, the piece mold 30 is separated from the upper mold 20, so that the piece mold 30 can be brought into contact with the exposed part 56 according to the inclination of the semiconductor chip 53.
Inventors:
TSUBAKI KOICHI
Application Number:
JP2013184903A
Publication Date:
March 19, 2015
Filing Date:
September 06, 2013
Export Citation:
Assignee:
DENSO CORP
International Classes:
B29C45/14; B29C33/12; H01L21/56
Attorney, Agent or Firm:
Patent business corporation paddle cause patent firm
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