Title:
RESIN MOLDING, AND CHIP FOR ANALYSIS
Document Type and Number:
Japanese Patent JP2014194003
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a resin molding which can be produced by a simple method and can maintain hydrophilicity of a surface for a long period of time.SOLUTION: A resin molding (T) is molded by melt blending a base resin (P), a surfactant (A) represented by a general formula R-X (R represents an alkyl group having 1 to 60 carbon atoms, and X represents a hydrophilic group), and a compound (B) which has a molecular weight less than the base resin (P) and more than the surfactant (A), and is at least one selected from polyether-esters, polyether-ester-amides, olefins modified with acid anhydrides, ethylene oxide-epichlorohydrin copolymers, polystyrene sulfonic acid salts, quarternary ammonium salt-containing acrylates, and ionomer resins.
Inventors:
OGAWA KEIJI
KAWAKAMI TADATSUGU
WAKIZAKA HIROYUKI
OYAMA MASATOSHI
KAWAKAMI TADATSUGU
WAKIZAKA HIROYUKI
OYAMA MASATOSHI
Application Number:
JP2014025695A
Publication Date:
October 09, 2014
Filing Date:
February 13, 2014
Export Citation:
Assignee:
UNIV SHIGA PREFECTURE
KAFEAL CORP
SHIGA PREFECTURE
KAFEAL CORP
SHIGA PREFECTURE
International Classes:
C08J5/00; B29C45/00; C08L101/00; G01N37/00
Domestic Patent References:
| JPH09111111A | 1997-04-28 | |||
| JPH11199667A | 1999-07-27 | |||
| JP2008039584A | 2008-02-21 | |||
| JPH09111111A | 1997-04-28 | |||
| JPH11199667A | 1999-07-27 | |||
| JP2008039584A | 2008-02-21 | |||
| JPH08157650A | 1996-06-18 | |||
| JPH08157650A | 1996-06-18 |
Foreign References:
| US20050049360A1 | 2005-03-03 | |||
| US20050049360A1 | 2005-03-03 |
Attorney, Agent or Firm:
Patent business corporation YKI international patent firm